What is GOB screen

GOB is short for GLUE ON BOARD. The GOB process is a new type of optical and thermal conductive nano-filling material. Through special techniques, it applies the conventional PCB, their surface-mounted lamps, and double-matte optical treatment to achieve a frosted effect on LED display’s surface, improving display’s existing protection technology and innovatively realizing the conversion from point light sources to surface light sources. It has a broad market in various fields.

Disadvantage of traditional screens

Currently, traditional screens are completely exposed to light-emitting bodies and have serious flaws.

1.Low protection level: not moisture-proof, waterproof, dust-proof, shock-proof, or collision-proof. In humid climate, a large number of dead lamps and broken lamps are prone to occur. Lamps are likely to fall off or get damaged in transportation. They are also easily affected by static electricity, resulting in dead lamps.

2.Harmful to eyes: long timing viewing can cause glare and fatigue, In addition, there is also "blue light harm" effect. Due to the short wavelength and high frequency of blue light LEDs, when the human eye is directly and continuously affected by blue light, it is prone to retinopathy.

Advantages of GOB screens

1.Eight protections: waterproof, moisture-proof, collision-proof, dust-proof, corrosion-proof, blue light-proof, salt-proof, and static electricity-proof.

2.Due to frosted surface effect, the color contrast is also increased, the conversion and display from view point light sources to surface light sources are realized, and viewing angle is increased as well.

Materials standard of GOB

The packaging materials for GOB must be customized based on GOB process plan and must meet the following characteristics: 1. Strong adhesion; 2. Strong tensile and vertical impact forces; 3. Hardness; 4. High transparency; 5. Temperature resistance; 6. Resistance to yellowing; 7. Resistance to salt spray; 8. High wear resistance; 9. Anti-static; 10. High voltage resistance, etc.

Packaging

The GOB packaging process should ensure packaging material completely fills the spaces between the lamps and covers the surfaces of the lamps, and is firmly attached to PCB. There should be no bubbles, pinholes, white spots, voids, or underfill on the bonding surface between the PCB and the glue.

Thickness Variation

The consistency of the glue thickness (precisely described as the consistency of the glue layer thickness on the surface of lamps). After GOB packaging, the uniformity of glue layer thickness on lamps needs to be ensured. Currently, the GOB process has been fully upgraded to version 4.0, with almost no thickness tolerance of the glue layer, flatness is perfect!

Various applications:

It is applicable to small-pitch LED displays, super-protective rental LED displays, super-protective floor-standing interactive LED displays, super-protective transparent LED displays, LED intelligent panel displays, LED intelligent billboard displays, LED creative displays, and so on.